Reading Thermal has introduced the Pan+Dough Probe, a fixed position, dough interface/core temperature measuring device that provides accurate, repeatable data that are not possible with hand-placed thermocouple probes.
“Bread bakers rely heavily on accurate measurements of the core temperature of the bread as it moves through the oven to ensure consistent quality,” said Richard Starke, director, Reading Thermal. “The Pan+Dough Probe has a stationary vertical probe that is always at a fixed penetration depth, as opposed to probes inserted into the loaf that can change position as the dough rises. The Pan+Dough Probe yields measurements that are always at the same reference point from one batch to the next.”
The Pan+Dough Probe is placed under the bread or bun dough and simultaneously captures the pan/dough interface temperature and the dough core temperature. The Pan+Dough Probe connects to a Temperature Interface device that can accommodate five Pan+Dough Probes. The probe’s copper spade is pressed against the pan by the weight of the dough, and measures the critical pan/dough interface temperature. The vertical, stainless steel, dough core temperature probe penetrates the dough at a fixed distance from the pan. These readings are used to produce the Bake Cycle S Curve indicating critical temperature points for yeast kill, gelatinization and arrival time as they relate to the percentage of travel through the baking chamber. SCORPION® Software Version 8 (SV8) automatically calculates the three S Curve data points. Environment temperature is also measurable using sensors connected to the Temperature Interface device